Bond Pull / Shear Tester

 
HAWK-8000S

Multi-Purpose single Catridgr Bond Test System

Conventional standard single catridge Bond Test System with various user-friendly and the most Convenient all in- one test mode of GUI program.

 
  • Conventional manual catridge change system
  • Multi purpose bond test system covering all th ecatridge Requirement up to 500Kg
       - wire(Bump)Pull / Peel test :- 100Kg
       - Shear test :- 500 Kg
       -  Customized test:Vending,Vectored,Press,Push,Etc
       *Please consult with factory for special customization of the test
  • Suitable for the repetitive test in mass production line
  • User-friendly,all in one GUI program in test mode and L-Joystick button for moving XY stage at its maximum speed, R-Joystick button for performing "Test start" instead of pressing "T" key
  • Programmable test speed,shear height,landing speed, overtravel,grade list & test conditions.
  • State-of -the-art Window 7GUI OS program
  • Networking to Host computer thru RS,Lan Connection
  • Test method meeting up international test regulation, JEDEC,MILs,EIA with test accuracy ± 0.15%
  • CE certified and patents reserved for the core technologies
 
 
HAWK-8000M

Rotating Multi-Catridge Bond Test System

Multifnctional Bond Tester System rotating catridge module achieved the most convient worability different tests

 
  • Automatic catridge change in 3 second
  • Multi-purpose bond test system covering all the catridge requirement up to 100Kg.
      - Wire (Bumo) up to 100Kg
      - Shear test :- 100Kg
      - Customized test: Vending,Vectored,press,Push,Etc.
      *Please consult with factory for special customization
  • The most ideal system for multi-purpose bond test.
  • User-Friendly all in one GUI programin test mode and L-Joystick button for performing "Test start" instead of pressing "T" key
  • Programmable test speed,shear height,landing sped,overtravel,grade list & test group
  • User friendly,state-of-the art Window 7 based GUI program
  • Networking thru RS232,422,TCP/IP,LAN
  • Test mesthod meeting up international test regulation,JEDEC,MILS,EIA with test accuract ±0.15%
  • CE certified and patents reserved for the core technologies
 
 
HAWK-8000-WS

Multi-Purpose Single Catridge Bond Test System with Wide Stage


HAWK-8000WS is a customized Bond test system to cover 300mm length to subtrates and able to conduct non-stop tesr in Y-axis due to its wider stage of 200X200 aand deeper Y-axis space to its well of the machine frame

 
  • Wide XY Stage,200X200 covering 300mm of high density subtrates . Other stage options are available per requirements
  • 600X700X700 machine size with deeper Y-axis from test tool center to the wall of the machine frame
  • Multi-puropose bond test system covering all the catridge requirement up to 100Kg
      - Wire(Bump) Pull/Peel test : ~100Kg
      - Shear test: ~ 100Kg
      - Customized test: Vending,Vectored,Press,Push,Etc.
       * Please consulrt with factory for special customization
  • Suitable for the wide,high-density subtrates
  • User - friendly,all in one GUI program in test mode and L-Joystick button for moving XY stage at its maximum speed,R-Joystick button for performing "Test start" instead of pressing "T" key
  • Programmable test speed,shear height,landing speed, overtravel,grade list & test group
  • User friendly,state -of the art Window & based GUI program
  • Networking thru RS232,422,TCP/IP,LAN
  • Test method meeting up international test regulation,JEDEC,MILS,EIA with test accuracy  ±0.15%
  • CE certified and patents reserved for the core technologies
 
 
HAWK-8120WS

12" Wafer Bump Micro Ball Bond Test System

HAWK-8120WS is a customized system to test test bondality of micro ball bump on 8-12°  wafers. Micro accuracy Ball shear test and Cold bump pull test on wafers is its representative functions

  • Wafer bump shear and pulll test with the largest XY stage coverage up to 12°   wafers
       - Minimized manual handling to prevent wafer damage
       - Wide XY Stage,430X300mm
       - One touch convertible wafer chuck to 12°  from 8°  wafer
  • Easier interconnection with any robot handling system
  • Auto-position detection by one-click on wafer image of GUI program
  • User - friendly,all in one GUI program in test mode and L-Joystick button for moving XY stage at its maximum speed,R-Joystick button for performing "Test start" instead of pressing "T" key
  • Ultra fine shear height control and loadless bottom touch.
  • Programmable test speed,shear height,landing speed,overtravel,grade list & test group 
  • User friendly,state- of -the art Window 7 based GUI program
  • Networking thru RS232,422, TCP/IP,LAN
  • Test method meeting up international test regulation JEDEC,MILs,EIA with test accuracy ±0.15%
  • CE certified and patents reserved for the core technologies
 
 
 
HAWK-8120WS-RV (RVK)

Robot Handfling WLP Bond Tester &Micro -Vickers Hardness Tester

8120WS-RVK is a fully automatic mulfunctional system integrated with 12" Wafer Bond Tester ,Micro-Vickers hardness tester and fully automatic robot handler. This system is unique in the world,developed to help customers who need bond test for micro ball(bumps0 and micro viskers hardness test for gold plated pad on 8~12° with automatic wafer handling system.Independently operating dual stages of bond tester and micro vickers hardness tester.

 
  • Unique integrated system of Automatic wafer handler + Bond Tester + Micro-vickers hardness Tester.
  • Wafer bump shear and pull test with the largest XY stage coverage up to 12° wafers.
      - Minimized manual handling to prevent wafer damage
      = Wide XY Stage,870X700mm
      -  One touch convertible wafer chuck to 12° from 8° wafer
  • Auto position detecting by one-click on wafer ima
  • User - friendly,all in one GUI program in test mode and L-Joystick button for moving XY stage at its maximum speed,R-Joystick button for performing "Test start" instead of pressing "T" key
  • Ultra fine shear height control and loadless bottom touch.
  • Programmable test speed,shear height,landing speed,overtravel,grade list & test group
  • User friendly,state- of -the art Window 7 based GUI program
  • Networking thru RS232,422, TCP/IP,LAN
  • CE certified and patents reserved for the core technologies
 
 
Test Capability

Total Solution with multi-purpose and flexible Bond Test Capability

Test solution applicable for Wire bonding, die bonding,Bumping,Film(tape),Ribbon Bonding,SMT, Solar cell and other small electric devices.

Applicable for testing: Bondability,ADhesiveness, Flexibility,Plasticity Tensible strength,Fatique ratio,Breaking strength

  • Wire Pull
  • Ball Shear
  • Die Shear
  • Cavity Shear
  • Fatique
  • Stud Pull
  • First Bond Ball Pull
  • Stud Bump Pull
  • High Force Pull
  • High Strain Rate
  • Hot Bump Pull
  • Bending
  • High Speed Impact
  • Passivation Layer Ball Shear
  • Ribbon Peel/Pull
  • Overhanging Die
  • Tweezer Peel
  • Wedge Shear
  • Zone Shear
  • Other Cuztomization